Huawei’s New AI Chip Challenges Rivals With Self-Built HBM

Huawei has unveiled an ambitious new roadmap for its Ascend AI processors. The plan details a path to advanced, domestically-produced chips through 2028. This move signals a major step in China’s pursuit of technological self-reliance. It also sets the stage for increased competition in the global AI hardware market.

The strategy was revealed at the recent Huawei Connect 2025 conference. According to a report from Reuters, the roadmap focuses on developing in-house technologies. This includes proprietary high-bandwidth memory (HBM) solutions.

Next-Gen Chips Feature Proprietary HBM Technology

The roadmap begins with the Ascend 950PR, slated for late 2026. This chip will be Huawei’s first to use its own HBM, called HiBL 1.0. It is designed primarily for AI inference tasks. The 950PR will offer impressive compute power for low-precision data formats.

It is projected to deliver 1 PFLOPS of FP8 compute. It will also provide 2 PFLOPS of FP4 performance. The chip’s interconnect bandwidth will reach 2 TB/s. This focus on inference is crucial for running complex AI models efficiently.

Advanced Training Chips and Future Plans Revealed

A sibling chip, the Ascend 950DT, will launch in the same quarter. It is specifically engineered for AI training workloads. The 950DT will utilize a more advanced HBM called HiZQ 2.0. This signifies a dual-track approach for different AI functions.

Looking further ahead, the Ascend 960 is planned for late 2027. It promises a significant jump in memory capacity and bandwidth. The chip is designed to handle even larger and more complex AI models. This demonstrates a clear commitment to long-term development.

The pinnacle is the Ascend 970, expected in 2028. While specific details are scarce, it represents the next leap in performance. This entire roadmap underscores Huawei’s determination to build a fully independent AI tech stack. It reduces reliance on foreign semiconductor technologies.

This detailed AI chip roadmap solidifies Huawei’s position as a key player. The company is pushing hard for semiconductor self-sufficiency. Its success could reshape the entire global AI hardware supply chain.

Info at your fingertips

What is the first chip in Huawei’s new roadmap?

The first new chip is the Ascend 950PR. It is scheduled for release in the fourth quarter of 2026. This chip will focus on AI inference tasks.

What is special about Huawei’s new HBM?

Huawei is developing its own high-bandwidth memory called HiBL and HiZQ. This move aims to achieve greater supply chain independence. It reduces reliance on external memory suppliers.

How does this roadmap affect the global AI market?

It introduces a new source of advanced AI accelerators. This could increase competition, particularly in China’s domestic market. It may also influence global supply dynamics.

Are these chips available outside of China?

It is highly unlikely due to current U.S. trade restrictions. These chips are primarily intended for the Chinese market. They are designed to serve local companies and AI initiatives.

What is the difference between the 950PR and 950DT?

The 950PR is optimized for AI inference, like running trained models. The 950DT is designed for the training phase of AI development. They serve two distinct parts of the AI workflow.

When is the most powerful chip, the Ascend 970, due?

The flagship Ascend 970 chip is currently planned for 2028. Specific technical specifications have not been fully disclosed yet. It represents the future peak of Huawei’s planned AI compute performance.

Trusted Sources: Reuters, South China Morning Post, The Financial Times.