Samsung’s Next HBM4 Chip Set for Dramatic 40% Speed Leap

Samsung has reportedly developed a significantly faster version of its next-generation HBM4 memory. The new chip will be unveiled at a major tech conference in February 2026. This development signals an intensifying battle for dominance in the high-stakes AI hardware market.

The news follows the recent showcase of Samsung’s first HBM4 chip. This newer version represents a major performance jump.

Unprecedented Bandwidth Gains Revealed

A report from TheElec provides the key details. The new HBM4 chip is expected to achieve a bandwidth of up to 3.3 terabytes per second. This is a massive 37.5% increase over the initial HBM4 design.

This performance leap stems from a complete architectural overhaul. Samsung has redesigned the chip’s stacked structure and its interface. These changes also improve the overall power efficiency of the memory.

Intensifying the High-Bandwidth Memory Race

The competition in the HBM sector is fierce. According to Reuters, SK Hynix has been a dominant force. Samsung’s aggressive push with a superior HBM4 chip is a direct challenge to its rival’s market position.

This technological advancement is critical for next-generation AI systems. Faster memory bandwidth allows AI models to process data more quickly. This directly translates to more powerful and efficient artificial intelligence applications.

Samsung’s accelerated HBM4 development marks a pivotal moment for AI hardware. The pursuit of higher bandwidth memory is fundamentally reshaping the tech landscape.

Info at your fingertips

What is HBM memory used for?

HBM, or High-Bandwidth Memory, is primarily used in advanced computing. It is essential for AI accelerators and high-performance graphics cards. It allows these processors to access vast amounts of data at incredible speeds.

How does Samsung’s new HBM4 compare to competitors?

Samsung’s upcoming chip claims a significant bandwidth advantage. It reportedly uses a more advanced 1c DRAM process compared to the 1b node used by rivals. This could give it a performance and efficiency edge.

When will this new HBM4 chip be available?

The chip will be unveiled at the ISSCC conference in February 2026. Mass production and commercial availability will likely follow sometime after that official reveal. The timeline indicates a 2026-2027 product launch window.

Why is HBM4 important for AI development?

AI models are growing larger and more complex. They require immense memory bandwidth to function without bottlenecks. HBM4’s speed is crucial for training and running the next wave of generative AI.

Trusted Sources

TheElec, Reuters