HONOR is preparing its Magic9 series for a September 28 launch. The phones are expected to arrive with major changes across cameras, processing, battery capacity and charging.

The headline hardware starts with Qualcomm’s Snapdragon 8 Elite Gen 6. According to the supplied information, the processor is manufactured using TSMC’s N2P 2nm process. The Magic9 is described as the first phone confirmed to use the chip.

Camera hardware is another major part of the HONOR Magic9 specifications. HONOR has partnered with German cinema camera company ARRI for the new system.

The main camera uses a 200MP sensor measuring 1/1.28 inch. It has an f/1.57 aperture and three axis optical image stabilization.

HONOR is also using a second 200MP sensor for telephoto photography. That sensor measures 1/1.4 inch and sits behind an f/2.6 periscope lens. The combination gives the Magic9 two unusually large high resolution camera sensors.

The ARRI work goes beyond the camera hardware. The Magic9 series includes LogC3 video encoding and cinema grade LUT color profiles.

LogC3 is designed to retain more information across highlights and shadows during video recording. The LUT profiles provide predefined color treatments associated with ARRI’s cinema workflow. These features give users more flexibility when working with recorded footage.

Battery capacity also moves higher with the new generation. The supplied specifications put the Magic9 Pro Max battery at 8,000mAh or more.

Chinese certification documents are reported to have confirmed 100W wired charging across the Magic9 lineup. That compares with charging of up to 80W on most Magic8 models mentioned in the source.

The Pro Max will also support high power wireless charging. A specific wireless charging rate has not yet been provided.

On the front, the Magic9 Pro Max is listed with a 6.8 to 6.9 inch LTPO OLED display. HONOR describes its resolution as 1.5K.

The panel supports variable refresh rates ranging from 1Hz to 120Hz. The phone also uses 2.5D curved glass.

Other listed hardware includes IP68 water and dust resistance, an ultrasonic fingerprint scanner and 3D face recognition. The rear camera housing uses an off centre layout with a textured ring around the module.

HONOR is also planning three Magic9 variants. One version includes an internal cooling fan built directly into the phone.

Active cooling is intended to reduce processor throttling during longer gaming sessions. Similar cooling systems have appeared in gaming phones, but HONOR is bringing the idea into its Magic flagship family.

The September 28 launch should provide the missing details around individual models and final configurations. For now, the Magic9 specifications point to a phone built around camera hardware, a new 2nm processor and much larger battery capacity.