Redmi is preparing to introduce its next gaming-focused handset later this month in China, and early disclosures suggest the company is attempting something the segment has struggled to achieve for years. The upcoming K90 Max is expected to combine active cooling hardware with full dust and water resistance, a pairing that has remained largely out of reach for smartphone makers.

The company has already confirmed that the device will include an internal cooling fan, a feature typically reserved for performance-heavy gaming phones. What stands out this time is Redmi’s claim that the same device will carry IP66, IP68 and IP69 ratings, covering both dust protection and varying degrees of water resistance. That combination, if delivered as stated, would mark a notable shift in how gaming smartphones are engineered.

The difficulty lies in the fundamentals of cooling design. Active cooling systems rely on airflow, which requires openings in the chassis. Those same openings have historically made it difficult to seal devices against dust and water intrusion. Manufacturers have often had to compromise, prioritizing thermal performance over durability, or vice versa.

Redmi appears to be addressing this with a sealed internal airflow structure. According to information shared on Weibo, the system is designed to isolate moving air from the rest of the phone’s internal components. The company has not released detailed technical documentation, leaving some questions about how the system performs under sustained use or in real-world conditions.

Other brands have approached the problem differently. ASUS, for example, has relied on external cooling attachments for its recent gaming phones, avoiding the need to integrate airflow systems directly into sealed bodies. Nubia’s RedMagic line has included internal fans, though with more limited ingress protection, particularly when it comes to dust resistance.

In that context, Redmi’s approach signals an attempt to close a gap that has persisted across several generations of gaming hardware. Whether the solution proves effective will likely depend on factors that remain undisclosed, including long-term durability and thermal efficiency under load.

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For now, the K90 Max is shaping up as a technically ambitious device. Its official debut, expected toward the end of April, will offer a clearer view of whether this design direction holds up beyond early claims.